London, Dresden - July 25th, 2000 - Systemonic, the Dresden-based wireless communication chip company, has announced the development of its next generation ASSP product, HiperSonic, the first and only chip on the market designed to meet two emerging broadband wireless standards: the European HiperLAN2 and the American IEEE802.11a. HiperSonic is Systemonic´s first commercial application of its proprietary DSP design architecture and methodology platform, OnDSP™, recently manifested in its M3 working prototype.

The HiperSonic chip is a fully programmable platform which addresses the physical layer of both standards by means of software changes. Systemonic´s OnDSP™- based architecture enables required adaptations to be implemented in the software layer, a solution not available to traditional hard-wired methods.

The new HiperLAN/2 and IEEE 802.11a standards are significant for wireless technology in Europe and the US as they operate at the cleaner, higher bandwidth frequency of 5 GHz which not only reduces interference but also allows a much higher data rate (50+ MBps, compared to Bluetooth´s 1 MBps and below), enabling the delivery of true multimedia wire-free internet access and distribution to the office and home.

CEO of Systemonic commented: We estimate the market opportunity created by the new HiperLAN2 and IEEE 802.11a standards to be worth several billion $ by 2004, representing a growing portion of the $19 billion wireless IC market.
HiperSonic´s specific capability to meet both standards, and the emerging need for broadband wireless mobile Internet access driven by killer applications such as Internet TV, places Systemonic in a position to play a dominant role in this new marketplace.

Prof. Dr. Gerhard Fettweis, Co-founder and Chief Technology Officer at Systemonic, added:
Our application specific OnDSP™ approach is breakthrough technology and potentially applicable to all new broadband wireless industry standards. This includes the Japanese MMAC and any new, higher bandwidth version of Bluetooth, further demonstrating our unique flexibility. The dual mode HiperSonic is a first step towards a unified hardware platform for the upcoming broadband wireless standards in the 5 GHz range

Systemonic currently employs over 30 electronics and computer science experts and plans to double this during the next year. Shipment of the first HiperSonic chipsets will take place during the first quarter of 2001. The company´s web site is www.systemonic.com.

About Systemonic
Systemonic is a wireless communications platform provider that delivers complete Silicon System Solutions that power wireless data, video and voice networks across standards, across the world. Its flexible, re-configurable platform allows customers to bring wireless communications products that support multiple standards to market faster, with more features, lower power consumption and at a lower total cost of ownership.

In November 2000, Systemonic completed second round funding of USD 30 million from an investment consortium led by Atlas Venture and APAX Europe IV, including, Krone mt, and Lehman Brothers.

Systemonic was founded in 1999 after four years of research at the University of Dresden.

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