Where did the name Tondelayo come from?


Systemonic's Tondelayo™ Radio is a dual-band front-end chipset solution comprised of the SRF1001 radio frequency and the SIF1001 intermediate frequency chips. The Tondelayo radio chipset supports all IEEE 802.11 and HiperLAN/2 frequency bands at 2.4 GHz and 5 GHz. The chipset is based around a Superheterodyne architecture, which offers superior receiver sensitivity and frequency selectivity over other competing architectures. This architecture was also chosen because of its ability to meet the stringent linearity requirements of the 64-QAM, OFDM waveform. Unlike competing architectures, Superheterodyne architectures are less susceptible to LO leakage and Tondelayo's IF sampling is immune to the I/Q mismatches inherent in other approaches.  


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  • Operates in the IEEE 802.11 and HiperLAN/2 frequency bands at 2.4-2.48 GHz and 5.15-5.825 GHz.

  • Low noise figure 5 GHz LNA integrated in the RF chip.

  • SiGe Process provides required phase noise and linearity to handle 64-QAM signals.

  • Single 465 MHz IF SAW filter for transmit and receive paths.

  • Gilbert cell mixers with active gain.

  • 50 dB of receive attenuation.

  • 50 Ohms matched RF ports.

  • 200 Ohms matched IF ports - differential signals for better common mode noise rejection.

  • Single-ended Baseband ports for connection to typical A/D and D/A.

  • Power down of unused transmit or receive stages by T/R signal.

  • Single supply operation.

  • Low cost, space saving flip-chip package.
 

  • Support for both 2.4 GHz and 5 GHz frequency bands is accomplished using the same RF/IF chipset.

  • Low-risk, flexible architecture keeps frequency synthesis off-chip.

  • Receive gain split between RF and IF chips minimizes layout and oscillation problems.

  • Gains of RF and IF chips account for transmit filter and SAW filter losses.

  • Parts are designed with appropriate level of back-off for OFDM performance.

  • Input and output impedances are matched on chip for easy integration with filters, ADC's, and DACs.

  • x4 pre-scalar on RF chip allows the use of inexpensive low-frequency PLL's.

  • Dynamically controllable receive gain maximizes carrier to noise ratio and prevents components from being driven into saturation.

  • Active mixers provide gain to amplify the signal before final transmit stage, thus help to minimize the requirement on external power amplifier.

  • Advanced SiGe process offers improved linearity and lower phase noise, which contribute to longer range.
 

 

  • 5 GHz and 2.4 GHz multi-protocol W-LAN Interface Cards and Access Points.

  • Enterprise Wireless LAN systems.

  • PDA, Notebook Computer.

  • 802.11a+b CardBus wireless transceiver.

  • Protocol-configurable W-LAN Access Points and Bridges for 'hot-spots' or public-area Wireless LANs.

  • Wireless Home Networking systems.

  • Consumer electronic devices for Wireless Digital, Audio, Video, Multimedia and Telephony.

  • Routers, cable modems, and television set-top boxes with wireless LAN capability.

  • Proprietary fixed-wireless protocols, point-to-point radios.
 

 

Process Technology 0.35m SiGe
Evaluation Platform Stand alone card
Reference Design Dual-band PC Card form factor with sample Windows driver and configuration utility
Frequency Band 2.4-2.48 GHz and 5.15-5.825 GHz
Supply Voltage 3.0 V
TX Output Power Level Average: -12.5 dBm
P1dB: -2 dBm
5 GHz LNA 4 dB Noise Figure and 28 dB gain
Packaging 24 pin, Low Temperature Coifed Ceramic (LTCC)
Packaging Dimensions 8mm x 8mm
Attenuation/Gain
SRF1001: Two 8 dB attenuator blocks
SIF1001: Two blocks adding up to 34 dB attenuation
IF Frequency 465 MHz
Baseband Interface 60 MHz IF sampled at 80 MHz
Receive Sensitivity 3 dB better than specification for all data rates
Power Consumption SRF1001: 693 mW (Rx), 585 mW (Tx), 36 mW (sleep mode)
SIF1001: 489 mW (Rx), 258 mW (Tx), 36 mW (sleep mode)
 

 





 

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